Sputtering requires a vacuum system in a big tank, the "Sputter Chamber" that holds the Sputter Cathode and the substrate coating stage, in which plastic housings can rotate. This is important so that the complete surface of the plastic housing will be covered. . The Sputter Cathode is comprised of a magnetic system located behind the target (the material to be sputtered) and a power feed from a DC Power Supply. After the correct vacuum pressure is achieved, Argon gas is admitted to the Sputter Chamber. Through the magnetic field and electric field potential, the Argon gas is ionized and subsequently accelerated toward the target material. The Argon Ion strikes the target with such force that it ejects a very small part of the target material outward, generally toward the substrate.
Through the design of magnet assemblies and geometry, the sputter process has been optimized for the highest material transfer rate while attempting to coat the substrate as uniformly. That notwithstanding, sputter deposition is still somewhat random and requires that masks and shields be implemented to control where the deposition takes place. Also, in a typical arrangement where the target material is flat, the erosion of the target is not uniform. The target tends to erode the fastest in areas of highest magnetic fields, creating grooves or channels in the target. When this groove depth approaches the target thickness, the target must be changed out. Typically, target utilization is not greater than 50%. However, for precious metals, used targets (as well as target material sputtered on shields and masks) may be re-cycled. Sputtering yields a very fine film coating that exhibits good adhesion and step coverage. One might liken it to a super fine spray can that sprays metal instead of paint.
Why Sputtered Coatings?
The Sputtering Process, if applied correctly, produces a very fine metal layer on the surface of a plastic part. This coating, which can be of nearly any metal or alloy, has good adhesion and exhibits good optical reflective quality on smooth moulded parts. In addition, Sputtered Coatings can be quite cost effective while adding value to the parts being coated. With the Plastics Industry facing cheap competition from overseas, the added value of Sputtered Parts is a good way to increase margins. Because Sputter Coating can often be applied In-Line to the moulding process, there is no penalty for cycle-time or parts throughput. Also, with the coating process in-line and in-house, the need to ship your parts to an outside coating service will be eliminated, saving production time and cost.
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Sputtering requires a vacuum system in a big tank, the "Sputter Chamber" that holds the Sputter Cathode and the substrate coating stage, in which plastic housings can rotate. This is important so that the complete surface of the plastic housing will be covered. . The Sputter Cathode is comprised of a magnetic system located behind the target (the material to be sputtered) and a power feed from a DC Power Supply. After the correct vacuum pressure is achieved, Argon gas is admitted to the Sputter Chamber. Through the magnetic field and electric field potential, the Argon gas is ionized and subsequently accelerated toward the target material. The Argon Ion strikes the target with such force that it ejects a very small part of the target material outward, generally toward the substrate. 
